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參數(shù)資料
| 型號(hào)： | TSL1401CS-LF |
| 廠商： | TAOS Inc. |
| 英文描述： | 128 】 1 LINEAR SENSOR ARRAY WITH HOLD |
| 中文描述： | 128】1傳感器陣列線性拒不退讓 |
| 文件頁(yè)數(shù)： | 14/18頁(yè) |
| 文件大?。?/td> | 266K |
| 代理商： | TSL1401CS-LF |
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TSL1401CSLF
128
×
1 LINEAR SENSOR ARRAY WITH HOLD
TAOS072E
APRIL 2007
14
Copyright 2007, TAOS Inc.
The
LUMENOLOGY
Company
www.taosinc.com
MANUFACTURING INFORMATION
This product, in the solder bump linear array package, has been tested and has demonstrated an ability to be
reflow soldered to a PCB substrate. The process, equipment, and materials used in these tests are detailed
below.
Tooling Required
Solder stencil (round aperture size 0.36 mm, stencil thickness of 152.4
μ
m)
20
×
20 frame for solder stencil
Process
1.
Apply solder paste using stencil
2.
Dispense adhesive dots
3.
Place component
4.
Reflow solder/cure
5.
X-Ray verify
Placement of the TSL1401CS
LF device onto the gold immersion substrate is accomplished using a standard
surface mount manufacturing process. First, using the stencil with 0.36 mm square aperture, print solder paste
onto the substrate. Next, dispense two 0.25 mm to 0.4 mm diameter dots of adhesive in opposing corners of
the TSL1401CS
LF mounting area. Machine place the TSL1401CS
LF from the JEDEC waffle carrier onto the
substrate. A suggested pick-up tool is the Siemens Vacuum Pickup tool nozzle number 912. This nozzle has
a rubber tip with a diameter of approximately 0.75 mm. The part is picked up from the center of the body. Reflow
the solder and cure the adhesive using the solder profile shown in Figure 14.
The reflow profiles specified here describe expected maximum heat exposure of components during the solder
reflow process of product on a PWB. Temperature is measured at the top of component. The components
should be limited to one pass through the solder reflow profile used.
Table 1. TSL1401CS
LF Solder Reflow Profile
PARAMETER
REFERENCE
TSL1401CS
LF
2.5
°
C/sec
2 to 3 minutes
Max 60 sec
Max 50 sec
Max 10 sec
260
°
C (
0
°
C/+5
°
C)
Max
5
°
C/sec
Average temperature gradient in preheating
Soak time
Time above T
1
, 217
°
C
Time above T
2
, 230
°
C
Time above T
3
, (T
peak
10
°
C)
Peak temperature in reflow
Temperature gradient in cooling
t
soak
t
1
t
2
t
3
T
peak
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