參數資料
型號: TSL2560CS
廠商: TAOS Inc.
英文描述: LIGHT-TO-DIGITAL CONVERTER
中文描述: 光到數字轉換器
文件頁數: 34/38頁
文件大?。?/td> 441K
代理商: TSL2560CS
TSL2560, TSL2561
LIGHT-TO-DIGITAL CONVERTER
TAOS059K
APRIL 2007
34
Copyright 2007, TAOS Inc.
The
LUMENOLOGY
Company
www.taosinc.com
MANUFACTURING INFORMATION
The CS and T packages have been tested and have demonstrated an ability to be reflow soldered to a PCB
substrate. The process, equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 13. TSL2560/61 Solder Reflow Profile
PARAMETER
REFERENCE
TSL2560/61
2.5
°
C/sec
2 to 3 minutes
Max 60 sec
Max 50 sec
Max 10 sec
260
°
C (
0
°
C/+5
°
C)
Max
5
°
C/sec
Average temperature gradient in preheating
Soak time
Time above 217
°
C
Time above 230
°
C
Time above T
peak
10
°
C
Peak temperature in reflow
Temperature gradient in cooling
t
soak
t
1
t
2
t
3
T
peak
t
3
t
2
t
1
t
soak
T
3
T
2
T
1
T
peak
Not to scale — for reference only
Time (sec)
T
Figure 23. TSL2560/TSL2561 Solder Reflow Profile Graph
相關PDF資料
PDF描述
TSL2560T LIGHT-TO-DIGITAL CONVERTER
TSL2561 LIGHT-TO-DIGITAL CONVERTER
TSL2561CS LIGHT-TO-DIGITAL CONVERTER
TSL2561T LIGHT-TO-DIGITAL CONVERTER
TSL2562 LOW-VOLTAGE LIGHT-TO-DIGITAL CONVERTER
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