參數(shù)資料
型號： TSOP35156
廠商： VISHAY SEMICONDUCTORS
元件分類： 光電元器件
英文描述： LINEAR OUTPUT PHOTO DETECTOR
封裝： ROHS COMPLIANT, MINIATURE, PLASTIC PACKAGE-4
文件頁數(shù)： 9/12頁
文件大?。?/td> 325K
代理商： TSOP35156
www.vishay.com
Document Number: 81780
6
Rev. 1.6, 04-Feb-11
TSOP351.., TSOP353.., TSOP355..
Vishay Semiconductors
IR Receiver Modules for Remote
Control Systems
PACKAGE DIMENSIONS in millimeters
ASSEMBLY INSTRUCTIONS
Reflow Soldering
Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Excercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
Finish soldering within 3 s
Handle products only after the temperature has cooled
off.
2.35
R 1.7
5.51
0.5 ± 0.15
3 x 1.27 =
3.81
2.6
7.5
7.2
4x
1.27
5.3
2.9
4
2.2
Pick and place area. TR taping
2.2
3 x 1.27 = 3.81
1.27
0.9
2.8
specifications
according to DIN
technical drawings
Not indicated tolerances ± 0.3
Pick and place area. TT taping
Footprint
(1.5)
(1.4)
Issue: 8; 02.09.09
16776
Drawing-No.: 6.544-5341.01-4
A
0.1
0.3
0.4
14
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