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參數(shù)資料
| 型號(hào)： | TSOP6256TT |
| 廠商： | VISHAY SEMICONDUCTORS |
| 元件分類： | 運(yùn)動(dòng)控制電子 |
| 英文描述： | Photo IC, LOGIC OUTPUT PHOTO DETECTOR, ROHS COMPLIANT, PLASTIC, SMD, 4 PIN |
| 中文描述： | Infrared Receivers 4.5-5.5V 56kHz Top View Taping |
| 文件頁(yè)數(shù)： | 7/15頁(yè) |
| 文件大小： | 994K |
| 代理商： | TSOP6256TT |
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TSOP62..
Document Number 82177
Rev. 1.4, 17-Nov-05
Vishay Semiconductors
www.vishay.com
7
Assembly Instructions
Reflow Soldering
Reflow soldering must be done within 72 hours
while stored under a max. temperature of 30 °C, 60
%
RH after opening the dry pack envelope.
Set the furnace temperatures for pre-heating and
heating in accordance with the reflow temperature
profile as shown in the diagram. Excercise extreme
care to keep the maximum temperature below
260 °C. The temperature shown in the profile means
the temperature at the device surface. Since there is
a temperature difference between the component and
the circuit board, it should be verified that the temper-
ature of the device is accurately being measured.
Handling after reflow should be done only after the
work surface has been cooled off.
Manual Soldering
Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C.
Finish soldering within three seconds.
Handle products only after the temperature has
cooled off.
Vishay Leadfree Reflow Solder Profile
0
50
100
150
200
250
300
0
50
100
150
200
250
300
t [sec]
T
255 °C
240 °C
217 °C
245 °C
max. 260 °C
max. 120 sec
max. 100 sec
max. 20 s
max. Ramp Up 3 °C/sec
max. Ramp Down 6 °C/sec
max. 2 cycles allowed
19800
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