參數資料
型號: TSPC603RMG8LC
英文描述: MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC
中文描述: 微處理器| 32位|的CMOS | BGA封裝| 255PIN |陶瓷
文件頁數: 4/42頁
文件大小: 961K
代理商: TSPC603RMG8LC
4
TSPC603R
2125A–12/01
Pin Assignments
CBGA 255 and CI-CGA
255 Packages
Figure 2 (pin matrix) shows the pinout as viewed from the top of the CBGA and CI-CGA pack-
ages. The direction of the top surface view is shown by the side profile of the packages.
Figure 2.
CBGA 255 and CI–CGA 255 Top View
T
B
C
D
E
F
G
H
J
K
L
M
N
P
R
01
16
15
14
13
12
11
10
09
08
07
06
05
04
03
02
A
Pin matrix top view
Not to scale
View
Encapsulant
Substrate Assembly
Die
CBGA 255
CI±CGA 255
相關PDF資料
PDF描述
TSPC603RMGU10LC MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC
TSPC603RMGU12LC MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC
TSPC603RMGU14LC MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC
TSPC603RMGU6LC MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC
TSPC603RMGU8LC MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC
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