參數(shù)資料
型號: TSPC603RMGS6LC
英文描述: MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC
中文描述: 微處理器| 32位|的CMOS | BGA封裝| 255PIN |陶瓷
文件頁數(shù): 37/42頁
文件大?。?/td> 961K
代理商: TSPC603RMGS6LC
37
TSPC603R
2125A–12/01
Mechanical
dimensions of the
CBGA package
Figure 15 provides the mechanical dimensions and bottom surface nomenclature of the CBGA
package.
Figure 15.
Mechanical Dimensions and Bottom Surface Nomenclature of the CBGA Package
CI-CGA Package
Parameters
The package parameters are as provided in the following list. The package type is 21 mm,
255-lead ceramic ball grid array (CI-CGA).
Package outline
21 mm x 21 mm
Interconnects
255
Pitch
1.27 mm
Typical module height
3.84 mm
Notes: 1. Dimensioning and tolerancing per
ASME Y14.5M
1994.
2. Controlling dimension: millimeter
Dim
A
B
C
D
G
H
K
N
P
Millimeters
Min
21.000 BSC
21.000 BSC 0.827 BSC
2.450
3.000
0.820
0.930
1.270 BSC
0.790
0.990
0.635 BSC
5.000
16.000
5.000
16.000
Inches
Min
0.827 BSC
Max
Max
0.097 0.118
0.032 0.036
0.050 BSC
0.031 0.039
0.025 BSC
0.197 0.630
0.197 0.630
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