參數(shù)資料
型號: TSS461
英文描述: Van Controller Serial Interface
中文描述: 范控制器串行接口
文件頁數(shù): 12/24頁
文件大小: 215K
代理商: TSS461
Qualpack TS80C31X2/C32X2
12
Rev. 2 – January 1999
4.2 Qualification Flow
General Requirements for Plastic packaged CMOS IC
Standard
Test Description
Qualification type
(acceptance)
MIL-STD 883D
Method 1005
Electrical Life Test (Early Failure Rate)
12 hours 150°C (Tj) 5.75V
Device
(1/2000 12h)
MIL-STD 883D
Method 1005
Electrical Life Test (Latent Failure Rate)
1000 hours 150°C 5.75V Dynamic or Static
Device
(0/116 500h)
MIL-STD 883D
Method 3015.7
Electrostatic Discharge HBM
+/-2000v 1.5kOhm/100pF/3 pulses
Device
(0/3 per level)
JEDEC 17
Latch up
50mW power injection 125°C
Device
(0/10)
MHS
PAQA0046
PROM Dataretention
High Temperature Storage 165°C
Device
(0/45 500h)
MIL-STD 883D
Method 1010
Temperature Cycling
1000 cycles -65°C/150°C air/air
Device and
Package
(0/45 500c)
MHS
PAQA0184
Pressure Pot after Mounting Stress
168 hours 130°C/85%RH
Device and
Package
(0/45 168h)
EIA
JESD22-A101
85/85 Humidity Test
1000 hours 85°C/85%RH
Die and Package
(0/45 500h)
EIA
JESD22-A110
HAST
336 hours 130°C/85%RH/5.5V
Device and
Package
(0/45 168h)
EIA
JESD22-A112
Resistance to Soldering Heat
Infra Red Stress 220°C/25s/3 times
Package
(0/10 per class)
MIL-STD 883D
Method 2003
Solderability
Package
(0/3)
MIL-STD 883D
Method 2015
Marking Permanency
Package
(0/3)
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