參數(shù)資料
型號(hào): TSS461CVAN
英文描述: Van Controller Serial Interface
中文描述: 范控制器串行接口
文件頁(yè)數(shù): 17/24頁(yè)
文件大小: 215K
代理商: TSS461CVAN
Qualpack TSS463 / TSS461C
Rev. 2 – January 1999
17
4.5.1 ESD and Latch-up results
Lot
Number
Z21538B
Device Type Test Description
Step
Resul
t
0/10
1/13
0/4
3/13
0/10
Comment
TSS463
SO 16
ESD HBM model
ESD CDM model
3000v
4000v
4500v
5000v
1500v
CLASS 2
Leackage pin 6
Leackages pin 2,6,15
CLASS C6 (EOS/ESD of
association)
Latch up Vcc
overstress
LU power injection
ESD HBM model
10v
50mW
0/10
0/10
Z19814
TSS461C
DIL 24.3
ESD CDM model
3000v
4000v
1500v
0/5
3/3
0/4
CLASS 2
Leakages
CLASS C6
TSS461C
Latch up Vcc
overstress
LU power injection
10v
50mW
0/10
0/10
4.5.2 Failure Mechanisms and Corrective Actions
Failure Mechanism
Root Cause
Corrective Action
Date
Effect
Check of
Efficiency
Poly silicide
defects
Process
conditions
Reduce silicide
temperature,
increase duration
Move to Nitto
MP8000
Nov 97
Robusteness
improved
EFR monitoring
Die top
delamination
Sumitomo630
0 molding
compound
Jan 98
No more
moitures
sensitivity
pass level 1 of
JESD 22 A112
4.5.3 Qualification status
The Wafer Process and the assembly are qualified and controlled by regular monitoring.
The TSS461C VAN is full qualified since 1996 July.
The TSS463 VAN is full qualified since 1997 October.
Additional measurements done in 1998 and generic results demonstrate compliance of the two products
to Q100 Automotive Standard.
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