• 參數(shù)資料
    型號: TSXPC603RMGS6LC
    英文描述: MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC
    中文描述: 微處理器| 32位|的CMOS | BGA封裝| 255PIN |陶瓷
    文件頁數(shù): 2/42頁
    文件大?。?/td> 961K
    代理商: TSXPC603RMGS6LC
    2
    TSPC603R
    2125A–12/01
    The 603r uses an advanced, 2.5/3.3V CMOS process technology and maintains full interface compatibility with TTL
    devices.
    The 603r integrates in system testability and debugging features through JTAG boundary-scan capability.
    General
    Description
    Figure 1.
    Block Diagram
    G suffix
    CBGA 255
    Ceramic Ball Grid Array
    GS suffix
    CI-CGA 255
    Ceramic Ball Grid Array
    with Solder Column Interposer (SCI)
    Completion
    Unit
    Fetch
    Unit
    Dispatch
    Unit
    Branch
    Unit
    Integer
    Unit
    Gen
    Reg
    Unit
    Gen
    Re-
    name
    Load/
    Store
    Unit
    FP
    Re-
    name
    FP
    Reg
    File
    Float
    Unit
    D MMU
    16K Data Cache
    I MMU
    16K Inst. Cache
    Bus Interface Unit
    System Bus
    32b
    address
    64b
    data
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