參數(shù)資料
型號: TSXPC750AVGU10LH
英文描述: Microprocessor
中文描述: 微處理器
文件頁數(shù): 18/44頁
文件大?。?/td> 870K
代理商: TSXPC750AVGU10LH
18
TSPC750A/740A
2128A–HIREL–01/02
HeatSinkSelectionExample
Forpreliminaryheatsinksizing,thedie-junctiontemperaturecanbeexpressedas
follows:
T
j
=T
a
+T
r
+(
θ
jc
+
θ
int
+
θ
sa
)*P
d
Where:
T
j
isthedie-junctiontemperature
T
a
istheinletcabinetambienttemperature
T
r
istheairtemperaturerisewithinthecomputercabinet
θ
jc
isthejunction-to-casethermalresistance
θ
int
istheadhesiveorinterfacematerialthermalresistance
θ
sa
istheheatsinkbase-to-ambientthermalresistance
P
d
isthepowerdissipatedbythedevice
Duringoperationthedie-junctiontemperatures(T
j
)shouldbemaintainedlessthanthe
valuespecifiedinTable4.Thetemperatureoftheaircoolingthecomponentgreatly
dependsupontheambientinletairtemperatureandtheairtemperaturerisewithinthe
electroniccabinet.Anelectroniccabinetinlet-airtemperature(T
a
)mayrangefrom30to
40
°
C.Theairtemperaturerisewithinacabinet(T
r
)maybeintherangeof5to10
°
C.
Thethermalresistanceofthethermalinterfacematerial(
θ
int
)istypicallyabout1
°
C/W.
AssumingaT
a
of30
°
C,aT
r
of5
°
C,aCBGApackage
θ
jc
=
2.2,andapowerconsump-
tion(P
d
)of4.5watts,thefollowingexpressionforT
j
isobtained:
Die-junctiontemperature:T
j
=30
°
C+5
°
C+(2.2
°
C/W+1.0
°
C/W+
θ
sa
)*4.5W
ForaThermalloyheatsink#2328B,theheatsink-to-ambientthermalresistance(
θ
sa
)
versusairflowvelocityisshowninFigure9.
Figure9.
Thermalloy#2328BHeatSink-to-AmbientThermalResistanceVersusAirflowVelocity
1
3
5
7
8
0.5
1
1.5
2
2.5
3
3.5
Thermalloy #2328B Pin±fin Heat Sink
(25 x 28 x 15 mm)
Approach Air Velocity m/s)
H
2
4
6
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