Product Folder: TWL1103, Voice Band Audio Processor
TWL1103, Voice Band Audio Processor
DEVICE STATUS: ACTIVE
PARAMETER NAME
TWL1103
Resolution (Bits)
15
Mic Inputs
2
Speaker Outputs
2
Programming Interface
I2C
Companding
u-, A-law
Internal DTMF/Tones
Yes
Speaker Impedance (min) (Ohms) 16
FEATURES
q
2.7-V Operation
q
Two Differential Microphone Inputs, One Differential Earphone Output, and One Single-Ended Earphone Output
q
Programmable Gain Amplifiers for Transmit, Receive, Sidetone, and Volume Control
q
Earphone Mute and Microphone Mute
q
On-Chip I2C Bus, Which Provides a Simple, Standard, Two-Wire Serial Interface With Digital ICs
q
Programmable for 15-Bit Linear Data or 8-Bit Companded (u-Law or A-Law) Data
q
Available in a 32-Pin Thin Quad Flatpack (TQFP) Package and an 80-Pin GQE MicroStar JuniorTM Ball Grid Array (BGA)
q
Designed for Analog and Digital Wireless Handsets and Telecommunications Applications
q
Dual-Tone Multifrequency (DTMF) and Single Tone Generator
q
Pulse Density Modulated (PDM) Buzzer Output
MicroStar Junior and VBAP are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
DESCRIPTION
The voice-band audio processor (VBAP) is designed to perform transmit encoding analog/digital (A/D) conversion, receive
decoding digital/analog (D/A) conversion, and transmit and receive filtering for voice-band communications systems. The
device operates in either the 15-bit linear or 8-bit companded (u-law or A-Law) mode, which is selectable through the I2C
interface. The VBAP generates its own internal clocks from a 2.048-MHz master clock input.
This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic
fields. These circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according
to MIL-STD-883C, Method 3015; however, it is advised that precautions be taken to avoid application of any voltage higher
than maximum-rated voltages to these high-impedance circuits. During storage or handling, the device leads should be
shorted together or the device should be placed in conductive foam. In a circuit, unused inputs should always be connected
to an appropriated logic voltage level, preferably either VCC or ground. Specific guidelines for handling devices of this type
are contained in the publication Guidelines for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies
available from Texas Instruments.
TECHNICAL RESOURCES
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