參數(shù)資料
型號: TWR-S08PT60
廠商: Freescale Semiconductor
文件頁數(shù): 9/37頁
文件大?。?/td> 0K
描述: TOWER SYSTEM MODULE S08PT60
標(biāo)準(zhǔn)包裝: 1
系列: S08
類型: MCU
適用于相關(guān)產(chǎn)品: Freescale 電源塔系統(tǒng)
所含物品: 板,線纜,DVD
Thermal specifications
5.3.1 Thermal characteristics
This section provides information about operating temperature range, power dissipation,
and package thermal resistance. Power dissipation on I/O pins is usually small compared
to the power dissipation in on-chip logic and voltage regulator circuits, and it is user-
determined rather than being controlled by the MCU design. To take PI/O into account in
power calculations, determine the difference between actual pin voltage and VSS or VDD
and multiply by the pin current for each I/O pin. Except in cases of unusually high pin
current (heavy loads), the difference between pin voltage and VSS or VDD will be very
small.
Table 8. Thermal characteristics
Rating
Symbol
Value
Unit
Operating temperature range
(packaged)
TA
-40 to 105
°C
Junction temperature range
TJ
-40 to 150
°C
Thermal resistance single-layer board
64-pin LQFP
θJA
71
°C/W
64-pin QFP
θJA
61
°C/W
48-pin LQFP
θJA
81
°C/W
44-pin LQFP
θJA
75
°C/W
32-pin LQFP
θJA
86
°C/W
Thermal resistance four-layer board
64-pin LQFP
θJA
53
°C/W
64-pin QFP
θJA
47
°C/W
48-pin LQFP
θJA
57
°C/W
44-pin LQFP
θJA
53
°C/W
32-pin LQFP
θJA
57
°C/W
The average chip-junction temperature (TJ) in °C can be obtained from:
TJ = TA + (PD × θJA)
Where:
TA = Ambient temperature, °C
5.3
Thermal specifications
MC9S08PT60 Series Data Sheet, Rev. 3, 4/2012.
Freescale Semiconductor, Inc.
17
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