參數(shù)資料
型號(hào): TXB0104DRG4
廠商: Texas Instruments
文件頁(yè)數(shù): 12/30頁(yè)
文件大?。?/td> 0K
描述: IC VOLT-LEVEL TRANSLATOR 14-SOIC
標(biāo)準(zhǔn)包裝: 2,500
邏輯功能: 變換器,雙向
位數(shù): 4
輸入類(lèi)型: 邏輯
輸出類(lèi)型: 邏輯
數(shù)據(jù)速率: 100Mbps
通道數(shù): 4
輸出/通道數(shù)目: 1
差分 - 輸入:輸出: 無(wú)/無(wú)
傳輸延遲(最大): 4ns
電源電壓: 1.2 V ~ 3.6 V,1.65 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
封裝/外殼: 14-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 14-SOIC
包裝: 帶卷 (TR)
YZT PACKAGE
(TOP VIEW)
D
C
B
A
3 2 1
SCES650F – APRIL 2006 – REVISED MAY 2012
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
TERMINAL ASSIGNMENTS
(YZT Package)
3
2
1
D
A4
GND
B4
C
A3
OE
B3
B
A2
VCCA
B2
A
A1
VCCB
B1
DESCRIPTION/ORDERING INFORMATION
This 4-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to
track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB
accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation
between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. To ensure the
high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor;
the minimum value of the resistor is determined by the current-sourcing capability of the driver.
The TXB0104 is designed so that the OE input circuit is supplied by VCCA.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(3)
NanoFree — WCSP (DSBGA)
0.23-mm Large Bump – YZT
Reel of 3000
TXB0104YZTR
_ _ _ 2 K _
(Pb-free) 0.625-mm max height
UFBGA – GXU
Reel of 2500
TXB0104GXUR
YE04
UFBGA – ZXU (Pb-Free)
Reel of 2500
TXB0104ZXUR
YE04
TXB0104RGYR
QFN – RGY
Reel of 1000
YE04
TXB0104RGYRG4
–40°C to 85°C
uQFN – RUT
Reel of 3000
TXB0104RUTR
2KR
TXB0104D
Tube of 50
TXB0104DG4
SOIC – D
TXB0104
TXB0104DR
Reel of 2500
TXB0104DRG4
TXB0104PWR
TSSOP – PW
Reel of 2000
YE04
TXB0104PWRG4
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2)
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3)
YZT: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
2
Copyright 2006–2012, Texas Instruments Incorporated
Product Folder Links: TXB0104
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