參數(shù)資料
型號: TZA1045TM
廠商: NXP SEMICONDUCTORS
元件分類: 消費(fèi)家電
英文描述: SPECIALTY CONSUMER CIRCUIT, PDSO16
封裝: 6.60 X 5.20 MM, 1.10 MM HEIGHT, PLASTIC, SOT-814-1, HTSSON-16
文件頁數(shù): 12/21頁
文件大?。?/td> 109K
代理商: TZA1045TM
2003 Dec 01
2
Philips Semiconductors
Preliminary specication
Photodiode and amplier IC for
CD and DVD applications
TZA1045
FEATURES
High frequency RF amplifiers
(typical bandwidth = 240 MHz)
Suitable for all CD (785 nm) and DVD (655 nm)
read/write applications
Four high bandwidth central outputs (A, B, C and D),
four satellite outputs (E, F, G, and H) and one high
bandwidth differential output (RFP, RFN)
Internal current clamp and current fold back (power
reduction)
Versatile programmable gain switches (CD/DVD, H/L
and R/W)
Single 5 V supply
Current outputs for optimum signal transport over flex
cable
Small outline packages, SSOP16T and HTSSON16T,
with good positional tolerance.
APPLICATIONS
CD and DVD read/write applications.
GENERAL DESCRIPTION
The TZA1045 is a single optical pick-up IC for read/write
systems and is suitable for CD and DVD applications.
The device contains eight RF amplifiers for the central and
satellite diodes and one differential RF amplifier (RFP
and RFN) which handles the sum of the four A, B, C, and D
central diode signals.
Programming the gain is a very versatile way to optimize
interfacing between the TZA1045 and the pre-amplifier.
The gain can be programmed for CD or DVD media with
the gain switch CD/DVD.
The H/L switch can be used for CD-R or CD-RW discs.
Gain switch R/W is used to reduce the gain during writing.
During writing, the high peak signals for the central and
satellite segments are clamped internally and the output
currents of the A, B, C, D, E, F, G and H segments are
reduced to almost zero (fold back) to minimize the power
consumption.
All outputs are current outputs that can supply a maximum
of 8 mA. In CD-R writing mode, the clipping level of the
output currents is between 5 and 8 mA.
The SSOP16T package has a low spread on the
z tolerance. The z tolerance is measured between the
diodes (chip surface) and the bottom of the leads. The
diodes have an offset of 54
m in the ‘y’ direction with
respect to the leadframe centre and a tolerance of
±50 m
in both ‘x’ and ‘y’ directions.
The diodes are placed under an angle of 45
°±1° with
respect to the leadframe of the module.
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TZA1045TS
SSOP16T
plastic shrink small outline package/transparent;
16 leads (straight); body width 4.4 mm
SOT734-1
TZA1045TM
HTSSON16T
plastic thermal enhanced thin shrink small outline
package/transparent; no leads; 16 terminals;
body 6.6
× 5.2 × 1.1 mm
SOT814-1
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