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參數(shù)資料
| 型號： | TZA3044U |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 通信及網(wǎng)絡 |
| 英文描述： | SDH/SONET STM4/OC12 and 1.25 Gbits/s Gigabit Ethernet postamplifiers |
| 中文描述： | SPECIALTY TELECOM CIRCUIT, UUC29 |
| 封裝： | 1.55 X 1.55 MM, DIE-29 |
| 文件頁數(shù)： | 25/28頁 |
| 文件大?。?/td> | 151K |
| 代理商： | TZA3044U |
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1999 Nov 03
25
Philips Semiconductors
Product specification
SDH/SONET STM4/OC12 and
1.25 Gbits/s Gigabit Ethernet postamplifiers
TZA3044; TZA3044B
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| TZA3047A | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:30 Mbits/s up to 1.25 Gbits/s laser drivers |
| TZA3047AVH | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:30 Mbits/s up to 1.25 Gbits/s laser drivers |
| TZA3047B | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:30 Mbits/s up to 1.25 Gbits/s laser drivers |
| TZA3047BVH | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:30 Mbits/s up to 1.25 Gbits/s laser drivers |
| TZA3047BVH/C1,551 | 功能描述:激光驅(qū)動器 3.3V D-LOOP LASERDRVR DC-1.25G RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube |
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