參數(shù)資料
型號: UA741IP
廠商: Texas Instruments, Inc.
英文描述: GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
中文描述: 通用運算放大器
文件頁數(shù): 3/19頁
文件大小: 448K
代理商: UA741IP
μ
A741,
μ
A741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
μ
A741Y chip information
This chip, when properly assembled, displays characteristics similar to the
μ
A741C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
×
4 MINIMUM
TJmax = 150
°
C.
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
+
OUT
IN+
IN–
VCC+
(7)
(3)
(2)
(6)
(4)
VCC–
(5)
(1)
OFFSET N2
OFFSET N1
45
36
(1)
(8)
(7)
(6)
(5)
(4)
(3)
(2)
相關(guān)PDF資料
PDF描述
UA741UFK GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
UA741UFKB GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
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UA741UJB GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
UA741UJG GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
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