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參數(shù)資料
| 型號： | UA741UFKB |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | GENERAL-PURPOSE OPERATIONAL AMPLIFIERS |
| 中文描述： | 通用運算放大器 |
| 文件頁數(shù)： | 3/19頁 |
| 文件大小： | 448K |
| 代理商： | UA741UFKB |
μ
A741,
μ
A741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
μ
A741Y chip information
This chip, when properly assembled, displays characteristics similar to the
μ
A741C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
×
4 MINIMUM
TJmax = 150
°
C.
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
+
–
OUT
IN+
IN–
VCC+
(7)
(3)
(2)
(6)
(4)
VCC–
(5)
(1)
OFFSET N2
OFFSET N1
45
36
(1)
(8)
(7)
(6)
(5)
(4)
(3)
(2)
相關PDF資料 |
PDF描述 |
|---|---|
| UA741UJ | GENERAL-PURPOSE OPERATIONAL AMPLIFIERS |
| UA741UJB | GENERAL-PURPOSE OPERATIONAL AMPLIFIERS |
| UA741UJG | GENERAL-PURPOSE OPERATIONAL AMPLIFIERS |
| UA741UJGB | GENERAL-PURPOSE OPERATIONAL AMPLIFIERS |
| UA741UU | GENERAL-PURPOSE OPERATIONAL AMPLIFIERS |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| UA741UJ | 制造商:TI 制造商全稱:Texas Instruments 功能描述:GENERAL-PURPOSE OPERATIONAL AMPLIFIERS |
| UA741UJB | 制造商:TI 制造商全稱:Texas Instruments 功能描述:GENERAL-PURPOSE OPERATIONAL AMPLIFIERS |
| UA741UJG | 制造商:TI 制造商全稱:Texas Instruments 功能描述:GENERAL-PURPOSE OPERATIONAL AMPLIFIERS |
| UA741UJGB | 制造商:TI 制造商全稱:Texas Instruments 功能描述:GENERAL-PURPOSE OPERATIONAL AMPLIFIERS |
| UA741UU | 制造商:TI 制造商全稱:Texas Instruments 功能描述:GENERAL-PURPOSE OPERATIONAL AMPLIFIERS |
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