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參數(shù)資料
| 型號(hào)： | UA741UJGB |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | GENERAL-PURPOSE OPERATIONAL AMPLIFIERS |
| 中文描述： | 通用運(yùn)算放大器 |
| 文件頁(yè)數(shù)： | 3/19頁(yè) |
| 文件大?。?/td> | 448K |
| 代理商： | UA741UJGB |
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μ
A741,
μ
A741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
μ
A741Y chip information
This chip, when properly assembled, displays characteristics similar to the
μ
A741C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
×
4 MINIMUM
TJmax = 150
°
C.
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
+
–
OUT
IN+
IN–
VCC+
(7)
(3)
(2)
(6)
(4)
VCC–
(5)
(1)
OFFSET N2
OFFSET N1
45
36
(1)
(8)
(7)
(6)
(5)
(4)
(3)
(2)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UA741UU | GENERAL-PURPOSE OPERATIONAL AMPLIFIERS |
| UA777 | HIGH-PERFORMANCE OPERATIONAL AMPLIFIER |
| UA777J | HIGH-PERFORMANCE OPERATIONAL AMPLIFIER |
| UA777JG | HIGH-PERFORMANCE OPERATIONAL AMPLIFIER |
| UA777N | HIGH-PERFORMANCE OPERATIONAL AMPLIFIER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UA741UU | 制造商:TI 制造商全稱:Texas Instruments 功能描述:GENERAL-PURPOSE OPERATIONAL AMPLIFIERS |
| UA741Y | 制造商:TI 制造商全稱:Texas Instruments 功能描述:GENERAL-PURPOSE OPERATIONAL AMPLIFIERS |
| UA747 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS |
| UA747-1MJB | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Voltage-Feedback Operational Amplifier |
| UA747AHMQB/C | 制造商:NAS 功能描述: 制造商:Texas Instruments 功能描述: |
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