參數(shù)資料
型號: UA741UU
廠商: Texas Instruments, Inc.
英文描述: GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
中文描述: 通用運算放大器
文件頁數(shù): 11/19頁
文件大?。?/td> 448K
代理商: UA741UU
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SOIC
Package
Drawing
D
Pins Package
Qty
75
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
UA741CD
ACTIVE
8
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UA741CDE4
ACTIVE
SOIC
D
8
75
CU NIPDAU
Level-1-260C-UNLIM
UA741CDG4
ACTIVE
SOIC
D
8
75
CU NIPDAU
Level-1-260C-UNLIM
UA741CDR
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
UA741CDRE4
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
UA741CDRG4
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
UA741CJG
UA741CJG4
UA741CP
OBSOLETE
OBSOLETE
ACTIVE
CDIP
CDIP
PDIP
JG
JG
P
8
8
8
TBD
TBD
Pb-Free
(RoHS)
Pb-Free
(RoHS)
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CU NIPDAU
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N / A for Pkg Type
50
UA741CPE4
ACTIVE
PDIP
P
8
50
CU NIPDAU
N / A for Pkg Type
UA741CPSR
ACTIVE
SO
PS
8
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UA741CPSRE4
ACTIVE
SO
PS
8
CU NIPDAU
Level-1-260C-UNLIM
UA741MFKB
UA741MJ
UA741MJB
UA741MJG
UA741MJGB
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
LCCC
CDIP
CDIP
CDIP
CDIP
FK
J
J
JG
JG
20
14
14
8
8
TBD
TBD
TBD
TBD
TBD
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(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2007
Addendum-Page 1
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