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參數(shù)資料
| 型號： | UA78U33CDCYR |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | POSITIVE-VOLTAGE REGULATORS |
| 中文描述： | 正電壓調(diào)節(jié)器 |
| 文件頁數(shù)： | 4/20頁 |
| 文件大小： | 569K |
| 代理商： | UA78U33CDCYR |
www.ti.com
Absolute Maximum Ratings
(1)
over virtual junction temperature range (unless otherwise noted)
Package Thermal Data
(1)
Recommended Operating Conditions
μ
A78M00 SERIES
POSITIVE-VOLTAGE REGULATORS
SLVS059P–JUNE 1976–REVISED OCTOBER 2005
MIN
MAX
UNIT
V
°
C
°
C
V
I
T
J
T
stg
Input voltage
Operating virtual junction temperature
Storage temperature range
35
150
150
–65
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PACKAGE
BOARD
θ
JP(2)
1.4
°
C/W
θ
JC
θ
JA
PowerFLEX/TO-252 – KTP
SOT-223 – DCY
TO-220 – KC/KCS
High K, JESD 51-5
High K, JESD 51-7
High K, JESD 51-5
19
°
C/W
30.6
°
C/W
17
°
C/W
28
°
C/W
53
°
C/W
19
°
C/W
3
°
C/W
(1)
Maximum power dissipation is a function of T
(max),
θ
, and T
. The maximum allowable power dissipation at any allowable ambient
temperature is P
= (T
(max) – T
)/
θ
. Operating at the absolute maximum T
of 150
°
C can affect reliability.
For packages with exposed thermal pads, such as QFN, PowerPAD, or PowerFLEX,
θ
JP
is defined as the thermal resistance between
the die junction and the bottom of the exposed pad.
(2)
MIN
5.3
MAX
UNIT
μ
A78M33
μ
A78M05
μ
A78M06
μ
A78M08
μ
A78M09
μ
A78M10
μ
A78M12
μ
A78M15
25
25
25
25
26
28
30
30
7
8
10.5
11.5
12.5
14.5
17.5
V
I
Input voltage
V
I
O
Output current
500
125
125
mA
μ
A78MxxC
μ
A78MxxI
0
T
J
Operating virtual junction temperature
°
C
–40
4
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