
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SOIC
MSOP
MSOP
SOIC
PDIP
Package
Drawing
D
DGK
DGK
D
P
Pins Package
Qty
75
80
2500
2500
50
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
UCC25705D
UCC25705DGK
UCC25705DGKTR
UCC25705DTR
UCC25705P
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
8
8
8
8
8
None
None
None
None
Pb-Free
(RoHS)
None
None
None
None
None
Pb-Free
(RoHS)
None
None
None
None
None
Pb-Free
(RoHS)
None
None
None
None
Pb-Free
(RoHS)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-NC-NC-NC
UCC25705PG4
UCC25706D
UCC25706DGK
UCC25706DGKTR
UCC25706DTR
UCC25706P
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SOIC
MSOP
MSOP
SOIC
PDIP
P
D
8
8
8
8
8
8
50
75
80
Call TI
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-NC-NC-NC
DGK
DGK
D
P
2500
2500
50
UCC25706PG4
UCC35705D
UCC35705DGK
UCC35705DGKTR
UCC35705DTR
UCC35705P
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SOIC
MSOP
MSOP
SOIC
PDIP
P
D
8
8
8
8
8
8
50
75
80
Call TI
CU NIPDAU
CU SNPB
CU SNPB
CU NIPDAU
CU NIPDAU
Call TI
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-NC-NC-NC
DGK
DGK
D
P
2500
2500
50
UCC35706D
UCC35706DGK
UCC35706DGKTR
UCC35706DTR
UCC35706P
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
MSOP
MSOP
SOIC
PDIP
D
8
8
8
8
8
75
100
2500
2500
50
CU NIPDAU
CU SNPB
CU SNPB
CU NIPDAU
CU NIPDAU
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-NC-NC-NC
DGK
DGK
D
P
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
PACKAGE OPTION ADDENDUM
www.ti.com
11-Mar-2005
Addendum-Page 1