參數(shù)資料
型號: UPB587G
廠商: NEC Corp.
英文描述: 1GHz INPUT DIVIDE BY 2, 4, 8 PRESCALER IC FOR PORTABLE SYSTEMS
中文描述: 1GHz的輸入除以2,4,8預(yù)分頻器集成電路針對便攜式系統(tǒng)
文件頁數(shù): 14/16頁
文件大?。?/td> 117K
代理商: UPB587G
14
P
PB1509GV
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1000 pF) to the V
CC
pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the
recommended conditions are to be consulted with our sales representatives.
P
PB1509GV
Soldering method
Soldering conditions
Recommended
condition symbol
Infrared ray reflow
Package peak temperature: 235
q
C,
Hour: within 30 s. (more than 210
q
C),
Time: 3 times, Limited days: no.
*
IR35-00-3
VPS
Package peak temperature: 215
q
C,
Hour: within 40 s. (more than 200
q
C),
Time: 3 times, Limited days: no.
*
VP15-00-3
Wave soldering
Soldering tub temperature: less than 260
q
C,
Hour: within 10 s.
Time: 1 time, Limited days: no.
WS60-00-1
Pin part heating
Pin area temparature: less than 300
q
C,
Hour: within 3 s./pin
Limited days: no.
*
*
It is the storage days after opening a dry pack, the storage conditions are 25
q
C, less than 65% RH.
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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相關(guān)代理商/技術(shù)參數(shù)
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