參數(shù)資料
型號(hào): UPC1694GR-E1
廠(chǎng)商: NEC Corp.
英文描述: GENERAL PURPOSE HIGH FREQUENCY WIDEBAND IC FOR FREQUENCY DOWN-CONVERTER
中文描述: 通用高壓高頻寬頻帶集成電路的頻率下變頻器
文件頁(yè)數(shù): 18/20頁(yè)
文件大?。?/td> 138K
代理商: UPC1694GR-E1
Data Sheet P12965EJ3V0DS00
18
μ
PC1694GR
NOTE ON CORRECT USE
(1) Since this IC uses high frequency process, care is required against the excessive input of static electricity, etc.
(2) Use the shortest possible wiring for the GND pin.
(3) Use the widest possible earth pattern to avoid increase of ground impedance (because it may cause abnormal
oscillation).
(4) Insert a bypass capacitor for the V
CC
pin (example: 1 000 pF, 2 200 pF, etc.)
(5) Abnormal oscillation may occur depending on the values of the choke coil and floating capacitance. Therefore,
insert a resistor between the power supply and choke coil. (See the application circuit example.)
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared Reflow
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit: None
Note
IR35-00-3
VPS
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit: None
Note
VP15-00-3
Wave Soldering
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None
Note
WS60-00-1
Partial Heating
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit: None
Note
Note
After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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