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參數(shù)資料
| 型號： | UPC3231GV-E1-A |
| 廠商： | CEL |
| 文件頁數(shù)： | 8/16頁 |
| 文件大小： | 0K |
| 描述： | IC AGC AMPLIFIER 5V 8-SSOP |
| 產(chǎn)品目錄繪圖： | UPB, UPC Series |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 應(yīng)用： | 自動增益控制（AGC） |
| 輸出類型： | 差分 |
| 電路數(shù)： | 1 |
| -3db帶寬： | 90MHz |
| 電流 - 電源： | 36mA |
| 電壓 - 電源，單路/雙路(±)： | 4.5 V ~ 5.5 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-LSSOP（0.126"，3.20mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SSOP |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 其它名稱： | UPC3231GV-E1-ADKR |
16
Data Sheet PU10658EJ01V0DS
PC3231GV
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired
oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to VCC line.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature)
: 260
C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220
C or higher
: 60 seconds or less
Preheating time at 120 to 180
C
: 120
30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
IR260
Wave Soldering
Peak temperature (molten solder temperature)
: 260
C or below
Time at peak temperature
: 10 seconds or less
Preheating temperature (package surface temperature)
: 120
C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (pin temperature)
: 350
C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
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