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參數(shù)資料
| 型號： | UPC667 |
| 廠商： | NEC Corp. |
| 英文描述： | 10-BIT D/A CONVERTER |
| 中文描述： | 10位D / A轉(zhuǎn)換器 |
| 文件頁數(shù)： | 11/12頁 |
| 文件大小： | 73K |
| 代理商： | UPC667 |
μ
PC667
11
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
For more details, refer to our document
“SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(IEI-1207)
.
Through-hole device
μ
PC667CT: 30-pin plastic Shrink DIP (400 mil)
Process
Conditions
Wave soldering
(only to leads)
Solder temperature: 260 C or below,
Flow time: 10 seconds or less.
Partial heating method
Terminal temperature: 300 C or below,
Heat time: 3 seconds or less (Per each lead).
Caution For through-hole devices, the wave soldering process must be applied only to leads, and make
sure that the package body does not get jet soldered.
#
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