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參數(shù)資料
| 型號(hào)： | UPC8100GR |
| 廠商： | NEC Corp. |
| 英文描述： | SILICON UP/DOWN CONVERTERS IC FOR 800 MHz to 900 MHz MOBILE COMMUNICATIONS |
| 中文描述： | 硅上/下變頻器集成電路800兆赫至900兆赫移動(dòng)通信 |
| 文件頁數(shù)： | 15/16頁 |
| 文件大?。?/td> | 141K |
| 代理商： | UPC8100GR |
15
μ
PC8100GR
Data Sheet P10817EJ3V0DS00
NOTE ON CORRECT USE
(1)
(2)
(3)
(4)
Observe precautions for handling because of electrostatic sensitive devices.
Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
Keep the track length of the ground pins as short as possible.
Connect a bypass capacitor (e.g. 1 000 pF) to the V
CC
pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering method and conditions than
the recommended conditions are to be consulted with our sales representatives.
μ
PC8100GR
Soldering conditions
Peak package’s surface temperature: 235
°
C or below,
Reflow time: 30 seconds or below (210
°
C or higher),
Number of reflow process: 2, Exposure limit
*
: None
Peak package’s surface temperature: 215
°
C or below,
Reflow time: 40 seconds or below (200
°
C or higher),
Number of reflow process: 2, Exposure limit
*
: None
Solder temperature: 260
°
C or below,
Flow time: 10 seconds or below
Number of flow process: 1, Exposure limit
*
: None
Terminal temperature: 300
°
C or below,
Flow time: 10 seconds or below,
Exposure limit
*
: None
Soldering
process
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Symbol
IR35–00-2
VP15–00-2
WS60–00-1
*:
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25
°
C and relative humidity at 65 % or less.
Note:
Apply only a single process at once, except for “Partial heating method”.
For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR
DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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