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參數(shù)資料
| 型號： | UPC8104GR-E1 |
| 廠商： | NEC Corp. |
| 英文描述： | UP CONVERTER + QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS |
| 中文描述： | 轉(zhuǎn)換器正交調(diào)制器集成電路的數(shù)字移動通信系統(tǒng) |
| 文件頁數(shù)： | 18/20頁 |
| 文件大小： | 156K |
| 代理商： | UPC8104GR-E1 |
Data Sheet P10099EJ4V0DS00
18
μ
PC8104GR
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electrostatic sensitive devices.
(2) Form a ground pattern as wide as possible to keep the minimum ground impedance (to prevent undesired
oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1 000 pF) to the V
CC
pin.
(5) I, Q DC offset voltage should be same as the I, Q DC offset voltage (to prevent changing the local leak level with
power save control.)
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
μ
PC8104GR
Soldering Method
Soldering Conditions
Symbol
Infrared ray reflow
Peak package’s surface temperature: 235
°
C or below,
Reflow time: 30 seconds or below (210
°
C or higher),
Number of reflow process: 3, Exposure limit
Note
: None
IR35-00-3
VPS
Peak package’s surface temperature: 215
°
C or below,
Reflow time: 40 seconds or below (200
°
C or higher),
Number of reflow process: 3, Exposure limit
Note
: None
VP15-00-3
Wave soldering
Solder temperature: 260
°
C or below
Flow time: 10 seconds or below,
Number of reflow process: 1, Exposure limit
Note
: None
WS60-00-1
Partial heating method
Terminal temperature: 300
°
C or below
Flow time: 3 seconds/pin or below,
Exposure limit
Note
: None
Note
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25
°
C and relative humidity at 65 % or less.
Caution
Apply only a single process at once, except for “Partial heating method”.
For details of recommended soldering conditions for surface mounting, refer to information
document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E)
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPC8105GR | 制造商:NEC 制造商全稱:NEC 功能描述:UP-CONVERTER WITH AGC FUNCTION QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS |
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| UPC8105GR-E1 | 功能描述:調(diào)節(jié)器/解調(diào)器 SO-16 QUAD MOD RoHS:否 制造商:Texas Instruments 封裝 / 箱體:PVQFN-N24 封裝:Reel |
| UPC8106 | 制造商:NEC 制造商全稱:NEC 功能描述:SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR/CORDLESS TELEPHONES |
| UPC8106T | 制造商:NEC 制造商全稱:NEC 功能描述:3 V, SILICON MMIC FREQUENCY UP-CONVERTER |
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