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參數(shù)資料
| 型號： | UPC8126GR-E1 |
| 英文描述： | RF Modulator |
| 中文描述： | 射頻調(diào)制器 |
| 文件頁數(shù)： | 36/40頁 |
| 文件大小： | 371K |
| 代理商： | UPC8126GR-E1 |
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36
μ
PC8130TA,
μ
PC8131TA
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). All
the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor (eg. 1000 pF) should be attached to the V
CC
pin.
(4) Impedance matching circuit must be each externally attached to input and output ports.
(5) The bias must be applied to output pin through the matching inductor. (The bias must not be applied to input
pin.)
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition
Symbol
Infrared Reflow
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit
Note
: None
IR35-00-3
VPS
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit
Note
: None
VP15-00-3
Wave Soldering
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit
Note
: None
WS60-00-1
Partial Heating
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit
Note
: None
–
Note
After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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