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參數(shù)資料
| 型號(hào)： | UPD16337GF-3BA |
| 廠商： | NEC Corp. |
| 英文描述： | 64-BIT AC-PDP DRIVER |
| 中文描述： | 64位交流PDP驅(qū)動(dòng) |
| 文件頁數(shù)： | 12/16頁 |
| 文件大?。?/td> | 102K |
| 代理商： | UPD16337GF-3BA |
μ
PD16337
12
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended below.
For soldering methods and conditions other than those recommended, please contact your NEC sales represen-
tative.
SURFACE MOUNT TYPE
For details of recommended soldering conditions, refer to the information document
“Semiconductor Device
Mounting Technology Manual” (C10535E)
.
μ
PD16337GF-3BA
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 230
°
C, Duration: 30 sec. MAX.
(at 210
°
C or above), Number of times: Twice, Time limit: None
Note
IR30-00-2
VPS
Package peak temperature: 215
°
C, Duration: 40 sec. MAX.
(at 200
°
C or above), Number of times: Twice, Time limit: None
Note
VP15-00-2
Pin partial heating
Pin partial temperature: 300
°
C MAX., Duration: 10 sec. MAX.,
Time limit: None
Note
Note
For the storage period after dry-pack decapsulation, storage conditions are max. 25
°
C, 65% RH.
Caution Use of more than one soldering method should be avoided (except in the case of pin partial
heating).
REFERENCES
NEC Semiconductor Device Reliability/Quality Control System (IEI-1212)
Quality Grade on NEC Semiconductor Devices (C11531E)
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