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參數(shù)資料
| 型號(hào)： | UPD16823GS |
| 廠商： | NEC Corp. |
| 英文描述： | MONOLITHIC H BRIDGE DRIVER |
| 中文描述： | 單片電路H橋驅(qū)動(dòng)器 |
| 文件頁(yè)數(shù)： | 7/8頁(yè) |
| 文件大?。?/td> | 71K |
| 代理商： | UPD16823GS |
μ
PD16823
7
RECOMMENDED SOLDERING CONDITIONS
It is recommended to solder this product under the conditions shown below.
For soldering methods and conditions other than those listed below, consult NEC.
For details of the recommended soldering conditions, refer to Information Document
“Semiconductor Device
Mounting Technology Manual” (C10535E)
.
Soldering Method
Soldering Condition
Symbol of Recommended
Soldering
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds MAX. (210
°
C MIN.)
Number of times: 2 MAX., Number of days: None
Note
, Flux: Rosin-based
flux with little chlorine component (chlorine: 0.2 Wt% MAX.)
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds MAX. (200
°
C MIN.)
Number of times: 2 MAX., Number of days: None
Note
, Flux: Rosin-based
flux with little chlorine component (chlorine: 0.2 Wt% MAX.)
VP15-00-2
Wave soldering
Package peak temperature: 260
°
C, Time: 10 seconds MAX.,
Preheating temperature: 120
°
C MAX., Number of times: 1, Flux:
Rosin-based flux with little chlorine component (chlorine: 0.2 Wt% MAX.)
WS60-00-1
Note
The number of days during which the product can be stored at 25
°
C 65% RH MAX. after the dry pack was
opened.
Caution Do not use two or more soldering methods in combination.
REFERENCE DOCUMENTS
Document Name
Document No.
NEC Semiconductor Device Reliability/Quality Control System
C11745E
Guide to Quality Assurance for Semiconductor Devices
MEI-1202
Safe Operating Area of Power MOS FET
TEA-1037
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