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Data Sheet S13020EJ1V0DS00
23
μ
PD16855
RECOMMENDED SOLDERING CONDITIONS
Soldering the
μ
PD16855 under the conditions listed in the table below is recommended.
For soldering methods and conditions other than those recommended, consult NEC.
Surface Mount Type
For the details of the recommended soldering conditions of the surface mount type, refer to information document
“Semiconductor Device Mounting Technology MANUAL” (C10535E)
μ
PD16855AG,
μ
PD16855BG,
μ
PD16855CG,
μ
PD16855DG
Soldering process
Soldering conditions
Symbol
Infrared ray reflow
Package peak temperature : 235 °C, Time : 30 seconds MAX.(210 °C MIN.),
Number of times : 2 , Number of days : not limited*
IR35-00-2
VPS
Package peak temperature : 215 °C , Time : 40 seconds MAX.(200 °C MIN.),
Number of times : 2 , Number of days : not limited*
VP15-00-2
Wave soldering
Soldering bath temperature : 260 °C MAX. , Time : 10 seconds MAX., Number
of times : 1 , Number of days : not limited*
WS60-00-1
Partial heating
method
Pin temperature : 300 °C MAX. (lead temperature), Time : 3 seconds MAX. (per
lead pin), Number of days : not limited*
* The number of days the devices can be stored at 25 °C, 65 % RH MAX. after the dry pack has been opened.
Caution Do not use two or more soldering methods in condition(except the pin partial heating method).
Throught-hole Type
μ
PD16855BC
Soldering process
Soldering conditions
Symbol
Wave soldering
Soldering bath temperature : 260 °C MAX., Time : 10 seconds MAX.
REFERENCE
Document Name
NEC semiconductor device reliability/quality control system
Quality grade on NEC semiconductor devices
Semiconductor device mounting technology manual
NEC IC Package Manual (CD-ROM)
Guide to quality assurance for semiconductor devices
Semiconductor selection guide
Document No.
IEI-1212
C11531E
C10535E
C13388E
MEI-1202
X10679E