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參數(shù)資料
| 型號： | UPD16875G |
| 廠商： | NEC Corp. |
| 英文描述： | DUAL Pch HIGH-SIDE SWITCH FOR USB |
| 中文描述： | 雙P溝道高側(cè)的USB開關(guān) |
| 文件頁數(shù)： | 16/20頁 |
| 文件大?。?/td> | 260K |
| 代理商： | UPD16875G |
Data Sheet S13895EJ1V0DS
16
μ
PD16875
RECOMMENDED SOLDERING CONDITIONS
The
μ
PD16875 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended, contact your NEC sales representative.
Surface Mount Type
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device
Mounting Technology Manual (C10535E
).
μ
PD16875G
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher),
Count: two times, Exposure limit: Not limited
Note
IR35-00-2
VPS
Package peak temperature: 215°C, Time: 40 sec. Max. (at 200°C or higher),
Count: two times, Exposure limit: Not limited
Note
VP15-00-2
Wave soldering
Solder bath temperature: 260°C Max., Time: 10 sec. Max., Count: once,
Exposure limit: not limited
Note
WS60-00-1
Partial heating
Pin temperature: 300°C Max., Time: 3 sec. Max., Exposure limit: not limited
Note
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Cautions Do not use different soldering methods together (except for partial heating).
REFERENCE
Quality Grades on NEC semiconductor Devices
Semiconductor Device Mounting Technology Manual
NEC Semiconductor Device Reliability/Quality Control System
Semiconductor Selection Guide
C11531E
C10535E
C10983E
X10679X
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