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參數(shù)資料
| 型號： | UPD17217 |
| 廠商： | NEC Corp. |
| 元件分類： | 4位微控制器 |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| 中文描述： | 4位單片機的小型通用紅外遙控器 |
| 文件頁數(shù)： | 76/84頁 |
| 文件大?。?/td> | 350K |
| 代理商： | UPD17217 |
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μ
PD17215, 17216, 17217, 17218
76
17. RECOMMENDED SOLDERING CONDITIONS
For the
μ
PD17215, 17216, 17217, and 17218, soldering must be performed under the following conditions.
For details of recommended conditions for surface mounting, refer to information document "Semiconductor device
mounting technology manual" (C10535E).
For other soldering methods, please consult with NEC personnel.
Table 17-1 Soldering Conditions of Surface Mount Tye
μ
PD17215GT-xxx:
μ
PD17216GT-xxx:
μ
PD17217GT-xxx:
μ
PD17218GT-xxx:
28-pin plastic SOP (375 mil)
28-pin plastic SOP (375 mil)
28-pin plastic SOP (375 mil)
28-pin plastic SOP (375 mil)
Soldering Method
Soldering Conditions
Symbol
Infrated Reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (210
°
C min.),
Number of times: 2 max., Days: 7 days* (after that, prebaking is
necessary for 20 hours at 125
°
C)
<Cautions>
Products other than those supplied in thermal-resistant tray (magazine, taping,
and non-thermal-resistant tray) cannot be baked in their packs.
IR35-207-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (210
°
C min.),
Number of times: 2 max., Days: 7 days* (after that, prebaking is
necessary for 20 hours at 125
°
C)
<Cautions>
Products other than those supplied in thermal-resistant tray (magazine, taping,
and non-thermal-resistant tray) cannot be baked in their packs.
VP15-207-2
Partial Heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per side of device)
—
*:
The number of days the device can be stored after the dry pack was opened, under storage conditions of 25
°
C and 65 % RH
max.
Caution: Do not use two or more solderong methods in combination (except the partial heating method).
Table 17-2 Soldering Conditions of Through-Hole Tye
μ
PD17215CT-xxx:
μ
PD17216CT-xxx:
μ
PD17217CT-xxx:
μ
PD17218CT-xxx:
28-pin plastic shrink DIP (400 mil)
28-pin plastic shrink DIP (400 mil)
28-pin plastic shrink DIP (400 mil)
28-pin plastic shrink DIP (400 mil)
Soldering Method
Soldering Conditions
Wave Soldering
(Only for pins)
Solder bath temperature: 260
°
C max., Time: 10 seconds max.
Partial Heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin)
Caution:
The wave solding must be performed at the lead part only. Note that the solder must not be directly
contacted to the package body.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| UPD17217CT | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17217GT | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17218 | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17218CT | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17218GT | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
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