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參數(shù)資料
| 型號： | UPD17228 |
| 廠商： | NEC Corp. |
| 元件分類： | 4位微控制器 |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| 中文描述： | 4位單片機的小型通用紅外遙控器 |
| 文件頁數(shù)： | 75/84頁 |
| 文件大?。?/td> | 393K |
| 代理商： | UPD17228 |
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μ
PD17225, 17226, 17227, 17228
75
Data Sheet U12643EJ2V0DS00
16. RECOMMENDED SOLDERING CONDITIONS
For the
μ
PD17225 soldering must be performed under the following conditions.
For details of recommended conditions for surface mounting, refer to information document
"Semiconductor
Device Mounting Technology Manual" (C10535E)
.
For other soldering methods, please consult with NEC personnel.
Table 16-1. Soldering Conditions of Surface Mount Type
(1)
μ
PD17225GT-
×××
: 28-pin plastic SOP (375 mil)
μ
PD17226GT-
×××
: 28-pin plastic SOP (375 mil)
μ
PD17227GT-
×××
: 28-pin plastic SOP (375 mil)
μ
PD17228GT-
×××
: 28-pin plastic SOP (375 mil)
Soldering Method
Soldering Conditions
Symbol
Infrated Reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (210
°
C min.),
Number of times: 2 max.
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (200
°
C min.),
Number of times: 2 max.
VP15-00-2
Wave Soldering
Solder bath temperature: 260
°
C max, Time: 10 seconds max., Number of times:
once, preheating temperature: 120
°
C max. (package surface temperature)
WS66-00-1
Partial Heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per side of device)
—
Caution
Do not use two or more soldering methods in combination (except the partial heating method).
(2)
μ
PD17225MC-
×××
-5A4: 30-pin plastic shrink SOP (300 mil)
μ
PD17226MC-
×××
-5A4: 30-pin plastic shrink SOP (300 mil)
μ
PD17227MC-
×××
-5A4: 30-pin plastic shrink SOP (300 mil)
μ
PD17228MC-
×××
-5A4: 30-pin plastic shrink SOP (300 mil)
Soldering Method
Soldering Conditions
Symbol
Infrated Reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (210
°
C min.),
Number of times: 3 max.
IR35-00-3
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (200
°
C min.),
Number of times: 3 max.
VP15-00-3
Wave Soldering
Solder bath temperature: 260
°
C max, Time: 10 seconds max., Number of times:
once, preheating temperature: 120
°
C max. (package surface temperature)
WS66-00-1
Partial Heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per side of device)
—
Caution
Do not use two or more soldering methods in combination (except the partial heating method).
Table 16-2. Soldering Conditions of Through-Hole Type
μ
PD17225CT-
×××
: 28-pin plastic shrink DIP (400 mil)
μ
PD17226CT-
×××
: 28-pin plastic shrink DIP (400 mil)
μ
PD17227CT-
×××
: 28-pin plastic shrink DIP (400 mil)
μ
PD17228CT-
×××
: 28-pin plastic shrink DIP (400 mil)
Soldering Method
Soldering Conditions
Wave Soldering
(Only for pins)
Solder bath temperature: 260
°
C max., Time: 10 seconds max.
Partial Heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin)
Caution The wave solding must be performed at the lead part only. Note that the solder must not be directly
contacted to the package body.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD17228CT | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17228CT-XXX | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROCONTROLLER|4-BIT|UPD17K CPU|CMOS|SDIP|28PIN|PLASTIC |
| UPD17228GT | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17228GT-XXX | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROCONTROLLER|4-BIT|UPD17K CPU|CMOS|SOP|28PIN|PLASTIC |
| UPD17228MC | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
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