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參數(shù)資料
| 型號(hào)： | UPD17230 |
| 廠商： | NEC Corp. |
| 元件分類： | 4位微控制器 |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| 中文描述： | 4位單片機(jī)的小型通用紅外遙控器 |
| 文件頁(yè)數(shù)： | 84/92頁(yè) |
| 文件大?。?/td> | 378K |
| 代理商： | UPD17230 |
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Data Sheet U14360EJ1V0DS00
μ
PD17230, 17231, 17232, 17233, 17234, 17235, 17236
84
16. RECOMMENDED SOLDERING CONDITIONS
For the
μ
PD17236 soldering must be performed under the following conditions.
For details of recommended conditions for surface mounting, refer to information document
"Semiconductor
Device Mounting Technology Manual" (C10535E)
.
For other soldering methods, please consult with NEC personnel.
Table 16-1. Soldering Conditions of Surface Mount Type
(1)
μ
PD17235GT-
×××
: 28-pin plastic SOP (375 mil)
μ
PD17236GT-
×××
: 28-pin plastic SOP (375 mil)
Soldering Method
Soldering Conditions
Symbol
Infrated reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (210
°
C min.),
Number of times: 2 max.
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (200
°
C min.),
Number of times: 2 max.
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C max, Time: 10 seconds max., Number of times:
once, preheating temperature: 120
°
C max. (package surface temperature)
WS66-00-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per side of device)
—
Caution
Do not use two or more soldering methods in combination (except the partial heating method).
(2)
μ
PD17230MC-
×××
-5A4: 30-pin plastic shrink SOP (300 mil)
μ
PD17231MC-
×××
-5A4: 30-pin plastic shrink SOP (300 mil)
μ
PD17232MC-
×××
-5A4: 30-pin plastic shrink SOP (300 mil)
μ
PD17233MC-
×××
-5A4: 30-pin plastic shrink SOP (300 mil)
μ
PD17234MC-
×××
-5A4: 30-pin plastic shrink SOP (300 mil)
μ
PD17235MC-
×××
-5A4: 30-pin plastic shrink SOP (300 mil)
μ
PD17236MC-
×××
-5A4: 30-pin plastic shrink SOP (300 mil)
Soldering Method
Soldering Conditions
Symbol
Infrated Reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (210
°
C min.),
Number of times: 3 max.
IR35-00-3
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (200
°
C min.),
Number of times: 3 max.
VP15-00-3
Wave soldering
Solder bath temperature: 260
°
C max, Time: 10 seconds max., Number of times:
once, preheating temperature: 120
°
C max. (package surface temperature)
WS66-00-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per side of device)
—
Caution
Do not use two or more soldering methods in combination (except the partial heating method).
相關(guān)PDF資料 |
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| UPD17231 | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17231MC | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17232 | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17233 | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17233MC | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD17230MC | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17231 | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17231MC | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17232 | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17232MC | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
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