μ
PD17704, 17705, 17707, 17708, 17709
10
19. BEEP ................................................................................................................................................ 287
19.1
Outline of BEEP.................................................................................................................... 287
19.2
I/O Selection Block and Output Selection Block .............................................................. 288
19.3
Clock Selection Block and Clock Generation Block ........................................................ 290
19.4
Output Waveform of BEEP .................................................................................................. 291
19.5
Status at Reset ..................................................................................................................... 291
20. STANDBY ........................................................................................................................................ 292
20.1
Outline of Standby Function ............................................................................................... 292
20.2
Halt Function ........................................................................................................................ 293
20.3
Clock Stop Function ............................................................................................................ 299
20.4
Device Operation in Halt and Clock Stop Status.............................................................. 301
20.5
Cautions on Processing of Each Pin in Halt and Clock Stop Status .............................. 301
20.6
Device Operation Control Function of CE Pin .................................................................. 303
21. RESET.............................................................................................................................................. 306
21.1
Outline of Reset.................................................................................................................... 306
21.2
CE Reset ............................................................................................................................... 307
21.3
Power-ON Reset ................................................................................................................... 313
21.4
Relationship between CE Reset and Power-ON Reset .................................................... 316
21.5
Reset by RESET Pin............................................................................................................. 320
21.6
WDT&SP Reset..................................................................................................................... 321
21.7
Power Failure Detection ...................................................................................................... 327
22. INSTRUCTION SET ......................................................................................................................... 332
22.1
Outline of Instruction Set .................................................................................................... 332
22.2
Legend .................................................................................................................................. 333
22.3
Instruction List ..................................................................................................................... 334
22.4
Assembler (RA17K) Embedded Macro Instruction .......................................................... 336
23. RESERVED SYMBOLS ................................................................................................................... 337
23.1
Data Buffer (DBF) ................................................................................................................. 337
23.2
System Registers (SYSREG)............................................................................................... 337
23.3
Port Registers....................................................................................................................... 338
23.4
Register File (Control Registers) ........................................................................................ 340
23.5
Peripheral Hardware Registers ........................................................................................... 345
23.6
Others.................................................................................................................................... 345
24. ELECTRICAL CHARACTERISTICS ................................................................................................ 346
25. PACKAGE DRAWING ..................................................................................................................... 349
26. RECOMMENDED SOLDERING CONDITIONS .............................................................................. 350
APPENDIX A. CAUTIONS ON CONNECTING CRYSTAL RESONATOR........................................... 351
APPENDIX B. DEVELOPMENT TOOLS............................................................................................... 352