參數(shù)資料
型號(hào)： UPD6134MC
廠商： NEC Corp.
英文描述： 4-BIT SINGLE-CHIP MICROCONTROLLER FOR INFRARED REMOTE CONTROL TRANSMISSION
中文描述： 4位單片機(jī)的紅外遙控傳輸
文件頁數(shù)： 57/64頁
文件大?。?/td> 410K
代理商： UPD6134MC
57
μ
PD6133, 6134
Data Sheet U10454EJ6V0DS00
15. RECOMMENDED SOLDERING CONDITIONS
Carry out the soldered packaging of this product under the following recommended conditions.
For details of the soldering conditions, refer to information material
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than the recommended conditions, please consult one of our NEC
sales representatives.
Table 15-1. Soldering Conditions for Surface-Mount Type
(1)
μ
PD6133GS-
×××
: 20-pin plastic SOP (300 mil)
μ
PD6134GS-
×××
: 20-pin plastic SOP (300 mil)
Soldering Method
Soldering Condition
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C; time: 30 secs. max. (210
°
C min.);
count: twice max.
IR35-00-2
VPS
Package peak temperature: 215
°
C; time: 40 secs. max. (200
°
C min.);
count: twice max.
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C max.; time: 10 secs. max.; count: once;
Preliminary heat temperature: 120
°
C max. (Package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300 C or less ; time: 3 secs. max. (for each side of the device)
—
Caution Using more than one soldering method should be avoided (except in the case of partial heating).
(2)
μ
PD6134MC-
×××
-5A4: 20-pin plastic SSOP (300 mil)
Soldering Method
Soldering Condition
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C; time: 30 secs. max. (210
°
C min.);
count: three times max.
IR35-00-3
VPS
Package peak temperature: 215
°
C; time: 40 secs. max. (200
°
C min.);
count: three times max.
VP15-00-3
Wave soldering
Solder bath temperature: 260
°
C max.; time: 10 secs. max.; count: once;
Preliminary heat temperature: 120
°
C max. (Package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300 C or less ; time: 3 secs. max. (for each side of the device)
—
Caution Using more than one soldering method should be avoided (except in the case of partial heating).
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