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參數(shù)資料
| 型號： | UPD6453 |
| 英文描述： | UPD6453 Data Sheet | Data Sheet[11/1990] |
| 中文描述： | UPD6453數(shù)據(jù)表|數(shù)據(jù)表[一千九百九十〇分之一十一] |
| 文件頁數(shù)： | 58/68頁 |
| 文件大?。?/td> | 301K |
| 代理商： | UPD6453 |
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58
μ
PD63, 63A, 64
15. RECOMMENDED SOLDERING CONDITIONS
Carry out the soldered packaging of this product under the following recommended conditions.
For details of the soldering conditions, refer to information material
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than the recommended conditions, please consult one of our NEC
sales representatives.
Table 15-1. Soldering Conditions for Surface-Mount Type
(1)
μ
PD63GS-
×××
μ
PD63AGS-
×××
: 20-pin plastic SOP (300 mil)
μ
PD64GS-
×××
: 20-pin plastic SOP (300 mil)
: 20-pin plastic SOP (300 mil)
Soldering Method
Soldering Condition
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C; time: within 30 secs. max. (210
°
C or higher);
count: no more than twice
IR35-00-2
VPS
Package peak temperature: 215
°
C; time: 40 secs. max. (200
°
C or higher); count:
no more than twice
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C max.; time: 10 secs. max.; count: once;
Preliminary heat temperature: 120
°
C max. (Package surface temperature)
Pin temperature: 300
°
C or less ; time: 3 secs or less (for each side of the device)
WS60-00-1
Partial heating
—
Caution Using more than one soldering method should be avoided (except in the case of partial
heating).
(2)
μ
PD64MC-
×××
-5A4: 20-pin plastic SSOP (300 mil)
Soldering Method
Soldering Condition
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C; time: within 30 secs. max. (210
°
C or higher);
count: no more than three times
IR35-00-3
VPS
Package peak temperature: 215
°
C; time: 40 secs. max. (200
°
C or higher); count:
no more than three times
VP15-00-3
Wave soldering
Solder bath temperature: 260
°
C max.; time: 10 secs. max.; count: once;
Preliminary heat temperature: 120
°
C max. (Package surface temperature)
Pin temperature: 300
°
C or less ; time: 3 secs or less (for each side of the device)
WS60-00-1
Partial heating
—
Caution Using more than one soldering method should be avoided (except in the case of partial
heating).
相關PDF資料 |
PDF描述 |
|---|---|
| UPD6453CY-001 | On-Screen Display Circuit |
| UPD6453GT-101 | On-Screen Display Circuit |
| UPD6454CS-001 | On-Screen Display Circuit |
| UPD6454GT-101 | On-Screen Display Circuit |
| UPD6456GS-101 | On-Screen Display Circuit |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| UPD6453CY | 制造商:NEC 制造商全稱:NEC 功能描述:MOS INTEGRATED CIRCUIT CMOS LSI FOR 12 lines X 24 columns CHARACTER DISPLAY ON SCREEN |
| UPD6453CY-001 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:On-Screen Display Circuit |
| UPD6453GT | 制造商:NEC 制造商全稱:NEC 功能描述:MOS INTEGRATED CIRCUIT CMOS LSI FOR 12 lines X 24 columns CHARACTER DISPLAY ON SCREEN |
| UPD6453GT-101 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:On-Screen Display Circuit |
| UPD6454CS-001 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:On-Screen Display Circuit |
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