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參數(shù)資料
| 型號： | UPD6461 |
| 廠商： | NEC Corp. |
| 英文描述： | CMOS LSI CHIP FOR CAMCORDER ON-SCREEN CHARACTER DISPLAY 12 ROWS x 24 COLUMNS |
| 中文描述： | 大規(guī)模集成電路芯片的CMOS攝像機屏幕字符顯示12行x 24個欄目 |
| 文件頁數(shù)： | 57/60頁 |
| 文件大小： | 411K |
| 代理商： | UPD6461 |
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57
μ
PD6461, 6462
9. RECOMMENDED SOLDERING CONDITIONS
When soldering these products, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales
offices.
For more details, refer to our document
“SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E)
.
Surface Mount Devices
μ
PD6461GS-xxx: 20-pin plastic shrink SOP (300 mil)
μ
PD6461GT-xxx: 24-pin plastic SOP (375 mil)
μ
PD6462GS-xxx: 20-pin plastic shrink SOP (300 mil)
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 235
°
C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210
°
C or higher),
Maximum number of reflow processes: 2 times.
IR35-00-2
Vapor phase soldering
Peak temperature: 215
°
C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200
°
C or higher),
Maximum number of reflow processes: 2 times.
VP15-00-2
Wave soldering
Solder temperature: 260
°
C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120
°
C or below (Package surface temperature).
WS60-00-1
Partial heating method
Pin temperature: 300
°
C or below,
Heat time: 3 seconds or less (Per each side of the device).
–
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the
device will be damaged by heat stress.
相關PDF資料 |
PDF描述 |
|---|---|
| UPD6461GS | CMOS LSI CHIP FOR CAMCORDER ON-SCREEN CHARACTER DISPLAY 12 ROWS x 24 COLUMNS |
| UPD6461GT | CMOS LSI CHIP FOR CAMCORDER ON-SCREEN CHARACTER DISPLAY 12 ROWS x 24 COLUMNS |
| UPD6462 | CMOS LSI CHIP FOR CAMCORDER ON-SCREEN CHARACTER DISPLAY 12 ROWS x 24 COLUMNS |
| UPD6462GS | CMOS LSI CHIP FOR CAMCORDER ON-SCREEN CHARACTER DISPLAY 12 ROWS x 24 COLUMNS |
| UPD6464A | ON-SCREEN CHARACTER DISPLAY CMOS LSI FOR 12-LINE, 24-COLUMN DECK-TYPE VCR |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| UPD6461GS | 制造商:NEC 制造商全稱:NEC 功能描述:CMOS LSI CHIP FOR CAMCORDER ON-SCREEN CHARACTER DISPLAY 12 ROWS x 24 COLUMNS |
| UPD6461GT | 制造商:NEC 制造商全稱:NEC 功能描述:CMOS LSI CHIP FOR CAMCORDER ON-SCREEN CHARACTER DISPLAY 12 ROWS x 24 COLUMNS |
| UPD6462 | 制造商:NEC 制造商全稱:NEC 功能描述:CMOS LSI CHIP FOR CAMCORDER ON-SCREEN CHARACTER DISPLAY 12 ROWS x 24 COLUMNS |
| UPD6462GS | 制造商:NEC 制造商全稱:NEC 功能描述:CMOS LSI CHIP FOR CAMCORDER ON-SCREEN CHARACTER DISPLAY 12 ROWS x 24 COLUMNS |
| UPD6464A | 制造商:NEC 制造商全稱:NEC 功能描述:ON-SCREEN CHARACTER DISPLAY CMOS LSI FOR 12-LINE, 24-COLUMN DECK-TYPE VCR |
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