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參數(shù)資料
| 型號： | UPD6465GT |
| 廠商： | NEC Corp. |
| 英文描述： | ON-SCREEN CHARACTER DISPLAY CMOS LSI FOR 12-LINE, 24-COLUMN DECK-TYPE VCR |
| 中文描述： | 屏幕字符顯示的CMOS大規(guī)模集成電路的12線，24柱甲板型錄像機(jī) |
| 文件頁數(shù)： | 50/52頁 |
| 文件大小： | 570K |
| 代理商： | UPD6465GT |
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μ
PD6464A,6465
50
10. RECOMMENDED SOLDERING CONDITIONS
Solder the
μ
PD6464A, 6465 under the conditions shown below.
For the details of the recommended soldering conditions, refer to
“Semiconductor Device Mounting
Technology Manual” (C10535E)
.
For other soldering methods and conditions, consult NEC.
Surface mount devices
μ
PD6464AGT-
×××
: 24-pin plastic SOP (375 mil)
μ
PD6465GT-
×××
: 24-pin plastic SOP (375 mil)
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 235
°
C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210
°
C or higher),
Maximum number of reflow processes: 2 times,
IR35-00-2
Vapor Phase Soldering
Peak temperature: 215
°
C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200
°
C or higher),
Maximum number of reflow processes: 2 times,
VP15-00-2
Wave Soldering
Solder temperature: 260
°
C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120
°
C or below (Package surface temperature),
WS60-00-1
Partial heating method
Pin temperature: 300
°
C or below,
Heat time: 3 seconds or less (Per each side of the device).
—
Caution
Apply only one kind of soldering condition to a device, except for “partial heating method”, or
the device will be damaged by heat stress.
Through-hole devices
μ
PD6464ACS-
×××
: 24-pin plastic shrink DIP (300 mil)
μ
PD6465CS-
×××
: 24-pin plastic shrink DIP (300 mil)
Process
Conditions
Wave soldering
(only to leads)
Solder temperature: 260
°
C or below,
Flow time: 10 seconds or less.
Partial heating method
Pin temperature: 300
°
C or below,
Heat time: 3 seconds or less (Per each lead).
Caution
For through-hole devices, the wave soldering process must be applied only to leads, and make
sure that the package body does not get jet soldered.
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