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參數(shù)資料
| 型號： | UPD6P5MC-5A4 |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR INFRARED REMOTE CONTROL TRANSMISSION |
| 中文描述： | 4位單片機的紅外遙控傳輸 |
| 文件頁數(shù)： | 24/32頁 |
| 文件大小： | 232K |
| 代理商： | UPD6P5MC-5A4 |
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24
μ
PD6P5
Data Sheet U14760EJ1V0DS00
8. RECOMMENDED SOLDERING CONDITIONS
Carry out the soldered packaging of this product under the following recommended conditions.
For details of the soldering conditions, refer to information material
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than the recommended conditions, please consult one of our NEC
sales representatives.
Table 8-1. Soldering Conditions for Surface-Mount Type
μ
PD6P5MC-5A4: 20-pin plastic SSOP (7.62 mm (300))
Soldering Method
Soldering Condition
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 sec. Max. (at 210
°
C or higher),
Count: three times or less
IR35-00-3
VPS
Package peak temperature: 215
°
C, Time: 40 sec. Max. (at 200
°
C or higher),
VP15-00-3
Count: three times or less
Wave soldering
Solder bath temperature: 260
°
C Max., Time: 10 sec. Max., Count: once,
Preheating temperature: 120
°
C Max. (package surface temperature)
Pin temperature: 300
°
C Max., Time: 3 sec. Max. (per pin row)
WS60-00-1
Partial heating
—
Caution Do not use different soldering methods together (except for partial heating).
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