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參數(shù)資料
| 型號(hào)： | UPD70F3015BY |
| 廠商： | NEC Corp. |
| 英文描述： | 32-BIT SINGLE-CHIP MICROCONTROLLER |
| 中文描述： | 32位單片機(jī) |
| 文件頁數(shù)： | 45/48頁 |
| 文件大?。?/td> | 413K |
| 代理商： | UPD70F3015BY |
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Data Sheet U14527EJ3V0DS
45
μ
PD70F3015B, 70F3015BY, 70F3017A, 70F3017AY
4. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD70F3015B, 70F3015BY, 70F3017A, and 70F3017AY should be soldered and mounted under the following
recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your sales representative.
Table 4-1. Surface Mounting Type Soldering Conditions
(1)
μ
PD70F3017AGC-8EU: 100-pin plastic LQFP (fine-pitch) (14
×
14 mm)
μ
PD70F3017AYGC-8EU: 100-pin plastic LQFP (fine-pitch) (14
×
14 mm)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less
Exposure limit: 3 days
Note
(after that, prebake at 125
°
C for 10 hours)
IR35-103-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Two times or less
Exposure limit: 3 days
Note
(after that, prebake at 125
°
C for 10 hours)
VP15-103-2
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
(2)
μ
PD70F3015BGC-8EU: 100-pin plastic LQFP (fine pitch) (14 x 14 mm)
μ
PD70F3015BYGC-8EU: 100-pin plastic LQFP (fine pitch) (14 x 14 mm)
μ
PD70F3017AF1-EA6: 121-pin plastic FBGA (12
×
12 mm)
μ
PD70F3017AYF1-EA6: 121-pin plastic FBGA (12
×
12 mm)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less
Exposure limit: 7 days
Note
(after that, prebake at 125
°
C for 10 hours)
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Two times or less
Exposure limit: 7 days
Note
(after that, prebake at 125
°
C for 10 hours)
VP15-107-2
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UPD70F3017A | 32-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD70F3017AY | 32-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD70F3017AF1-EA6 | V850/SA1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD70F3017AGC-8EU | V850/SA1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD70F3015BYGC-8EU | 32-BIT SINGLE-CHIP MICROCONTROLLER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD70F3015BYGC-8EU | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD70F3015BYGC-8EU-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD70F3017A | 制造商:NEC 制造商全稱:NEC 功能描述:32-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD70F3017AF1-EA6 | 制造商:NEC 制造商全稱:NEC 功能描述:32-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD70F3017AGC-8EU | 制造商:NEC Electronics Corporation 功能描述: |
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