參數(shù)資料
型號(hào)： UPD72012GB-XXX-3B4
廠商： NEC Corp.
英文描述： HUB CONTROLLER FOR UNIVERSAL SERIAL BUS
中文描述： 集線器控制器通用串行總線
文件頁數(shù)： 34/36頁
文件大?。?/td> 414K
代理商： UPD72012GB-XXX-3B4
34
Data Sheet S13918EJ3V0DS
μ
PD72012
5. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD72012 should be soldered and mounted under the following recommended conditions. For the details of
the recommended soldering conditions, refer to the document
Semiconductor Device Mounting Technology
Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Surface mount type soldering conditions
μ
PD72012GB-XXX-3B4: 44-pin plastic QFP (10
×
10)
Soldering Method
Soldering Conditions
Recommended
Condition Code
Infrared reflow
Peak package temperature: 235
°
C, Time: 30 sec. max. (210
°
C min.), Count: three
times or less
IR35-00-3
VPS
Peak package temperature: 215
°
C, Time: 40 sec. max. (200
°
C min.), Count: three
times or less
VP15-00-3
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 sec. max., Count: once,
Preheating temperature: 120
°
C max. (package surface temperature)
WS60-00-1
Pin partial heating
Pin temperature: 300
°
C max., Time: 3 sec. max. (per device side)
–
Caution
Avoid using different soldering methods together. (However, the pin partial heating method is
excluded.)
Through-hole type soldering conditions
μ
PD72012CU-XXX: 42-pin plastic SDIP (15.24 mm (600))
Soldering Method
Soldering Conditions
Wave soldering (pins
only)
Solder bath temperature: 260
°
C max., Time: 10 sec. max.
Pin partial heating
Pin temperature: 300
°
C max., Time: 3 sec. max. (per pin)
Caution
Apply wave soldering only to the pins, and exercise care that solder does not directly contact
the package.
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