參數(shù)資料
型號(hào)： UPD750108CU-XXX
廠商： NEC Corp.
英文描述： MICROCONTROLLER|4-BIT|UPD75XL CPU|CMOS|SDIP|42PIN|PLASTIC
中文描述： 單片機(jī)| 4位| UPD75XL的CPU |的CMOS | SDIP接插| 42PIN |塑料
文件頁(yè)數(shù)： 70/80頁(yè)
文件大?。?/td> 525K
代理商： UPD750108CU-XXX
μ
PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)
70
16. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD750104,
μ
PD750106, and
μ
PD750108 should be soldered and mounted under the conditions recom-
mended in the table below.
For detail of recommended soldering conditions, refer to the information document
SMD Surface Mount
Technology Manual
(C10535E).
For soldering methods and conditions other than those recommended below, contact our sales personnel.
Table 16-1. Surface Mounting Type Soldering Conditions
μ
PD750104GB-
×××
-3BS-MTX
μ
PD750106GB-
×××
-3BS-MTX
μ
PD750108GB-
×××
-3BS-MTX
μ
PD750104GB(A)-
×××
-3BS-MTX : 44-pin plastic QFP (10
×
10 mm, 0.8-mm pitch)
μ
PD750106GB(A)-
×××
-3BS-MTX : 44-pin plastic QFP (10
×
10 mm, 0.8-mm pitch)
μ
PD750108GB(A)-
×××
-3BS-MTX : 44-pin plastic QFP (10
×
10 mm, 0.8-mm pitch)
: 44-pin plastic QFP (10
×
10 mm, 0.8-mm pitch)
: 44-pin plastic QFP (10
×
10 mm, 0.8-mm pitch)
: 44-pin plastic QFP (10
×
10 mm, 0.8-mm pitch)
Caution Use of more than one soldering method should be avoided (except for partial heating method).
Table 16-2. Insertion Type Soldering Conditions
μ
PD750104CU-
×××
μ
PD750106CU-
×××
μ
PD750108CU-
×××
μ
PD750104CU(A)-
×××
: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
μ
PD750106CU(A)-
×××
: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
μ
PD750108CU(A)-
×××
: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
Package peak temperature: 235
°
C
Duration: 30 seconds max. (at 210
°
C or above)
Maximum allowable number of reflow processes: 3
Package peak temperature: 215
°
C
Duration: 40 seconds max. (at 200
°
C or above)
Maximum allowable number of reflow processes: 3
Solder bath temperature: 260
°
C max.
Duration: 10 seconds max.
Number of times: 1
Preliminary heat temperature: 120
°
C max. (package surface temperature)
Terminal temperature: 300
°
C max.
Duration: 3 seconds max. (per device side)
IR35-00-3
VP15-00-3
WS60-00-1
-
Infrared reflow
VPS
Wave
soldering
Partial heating
method
Soldering
method
Soldering conditions
Soldering method
Soldering conditions
Wave soldering (terminal only)
Partial heating method
Solder bath temperature: 260
°
C max., Duration: 10 seconds max.
Terminal temperature: 300
°
C max., Duration: 3 seconds max. (for each pin)
Caution Apply wave soldering to terminals only. See to it that the jet solder does not contact with the
chip directly.
Symbol
相關(guān)PDF資料
PDF描述
UPD750108GB-XXX-3BS-MTX MICROCONTROLLER|4-BIT|UPD75XL CPU|CMOS|QFP|44PIN|PLASTIC
UPD750106CU-XXX MICROCONTROLLER|4-BIT|UPD75XL CPU|CMOS|SDIP|42PIN|PLASTIC
UPD75036GC DIODE ZENER SINGLE 500mW 47Vz 2.7mA-Izt 0.05 0.1uA-Ir 36Vr DO35-GLASS 5K/AMMO
UPD75036 4 BIT SINGLE-CHIP MICROCOMPUTER
UPD75036CW 4 BIT SINGLE-CHIP MICROCOMPUTER
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
UPD7507C189 制造商:Panasonic Industrial Company 功能描述:IC
UPD7508CU265 制造商:Panasonic Industrial Company 功能描述:IC
UPD75208 制造商:Panasonic Industrial Company 功能描述:IC
UPD753012AGC-P33-8BT-A 制造商:Renesas Electronics Corporation 功能描述:
UPD753016AGC-P29-8BT 制造商:Renesas Electronics Corporation 功能描述:
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*