51
μ
PD75112(A), 75116(A)
Recommended Condition Symbol
IR30-00-1
VP15-00-1
WS60-00-1
Table 13-2 Insertion Type Soldering Conditions
μ
PD75112CW(A)-
×××
:
64-pin plastic shrink DIP (750 mil)
μ
PD75116CW(A)-
×××
:
64-pin plastic shrink DIP (750 mil)
13.
Recommended Soldering Conditions
The
μ
PD75112(A) and 75116(A) should be soldered and
mounted under the conditions recommended in the
table below.
For detail of recommended soldering conditions, refer
to the information document
“Surface Mount Technol-
ogy Manual” (IEI-1207)
.
For soldering methods and conditions other than those
recommended below, contact our sales personnel.
Table 13-1 Surface Mounting Type Soldering Conditions
μ
PD75112GF(A)-
×××
-3BE : 64-pin plastic QFP (14
×
20mm)
μ
PD75116GF(A)-
×××
-3BE : 64-pin plastic QFP (14
×
20mm)
Soldering Method
Infrared reflow
VPS
Wave soldering
Pin part heating
Soldering Conditions
Package peak temperature: 230
°
C Duration: 30 sec. max. (at 210
°
C above)
Number of times: Once
Package peak temperature: 215
°
C Duration: 40 sec. max. (at 200
°
C above)
Number of times: Once
Solder bath temperature: 260
°
C max. Duration: 10 sec. max.
Number of times: Once
Preliminary heat temperature: 120
°
C max. (Package surface temperature)
Pin part temperature: 300
°
C max. Duration: 3 sec. max. (per device side)
Note: Use more than one soldering method should
be avoided (except in the case of pin part).
Soldering Method
Wave soldering (lead part only)
Pin part heating
Soldering Conditions
Solder bath temperature: 260
°
C max. Duration: 10 sec. max.
Pin part temperature: 260
°
C max. Duration: 10 sec. max.
Note: Wave soldering is only for the lead part in order
that jet solder can not contact with the chip.
#
Notice
A version of this product with improved recommended
soldering conditions is available.
For details (improvements such as infrared reflow
peak temperature extension (235
°
C, number of times:
twice, relaxation of time limit), contact NEC sales