參數(shù)資料
型號(hào)： UPD753016GK-XXX-BE9
廠商： NEC Corp.
英文描述： MICROCONTROLLER|4-BIT|UPD75XL CPU|CMOS|TQFP|80PIN|PLASTIC
中文描述： 單片機(jī)| 4位| UPD75XL的CPU |的CMOS | TQFP封裝| 80腳|塑料
文件頁(yè)數(shù)： 71/80頁(yè)
文件大?。?/td> 569K
代理商： UPD753016GK-XXX-BE9
71
μ
PD753012, 753016, 753017
(2)
μ
PD753012GK-XXX-BE9: 80-pin plastic TQFP (fine pitch) (12
×
12 mm)
μ
PD753016GK-XXX-BE9: 80-pin plastic TQFP (fine pitch) (12
×
12 mm)
μ
PD753017GK-XXX-BE9: 80-pin plastic TQFP (fine pitch) (12
×
12 mm)
Symbol of
Recommended
Condition
Soldering Method
Soldering Conditions
Infrared reflow
Package peak temperature: 235 C, Time: 30 seconds max. (210 C min.),
Number of times: 2 max., Number of days: 7
Note
(After that, prebaking
is necessary at 125 C for 10 hours.)
IR35-107-2
<Precaution>
Products other than those packed in heat-resistant trays (such as those
packed in a magazine, taping, or non-heat-resistant tray) cannot be baked
while they are in their packaging.
VPS
Package peak temperature: 215 C, Time: 40 seconds max. (200 C min.),
Number of times: 2 max., Number of days: 7
Note
(After that, prebaking
is necessary at 125 C for 10 hours.)
VP15-107-2
<Precaution>
Products other than those packed in heat-resistant trays (such as those
packed in a magazine, taping, or non-heat-resistant tray) cannot be baked
while they are in their packaging.
Pin partial heating
Pin temperature: 300 C max., Time: 3 seconds max. (per side of device)
–
Note
The number of days for storage after the dry pack has been opened. The storing conditions are
25 C, 65% RH max.
Caution Do not use two or more soldering methods in combination (except partial heating).
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