參數(shù)資料
型號： UPD753106GC
廠商： NEC Corp.
元件分類： 4位微控制器
英文描述： 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER
中文描述： 4位單片機(jī)的小型通用紅外遙控器
文件頁數(shù)： 80/90頁
文件大?。?/td> 547K
代理商： UPD753106GC
80
μ
PD753104, 753106, 753108
15. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD753108 should be soldered and mounted under the conditions recommended in the table below.
For details of recommended soldering conditions, refer to the information document
“Semiconductor Device
Mounting Technology Manual” (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Table 15-1. Surface Mounting Type Soldering Conditions
(1)
μ
PD753104GC-xxx-AB8 : 64-pin plastic QFP (14 x 14 mm, 0.8-mm pitch)
μ
PD753106GC-xxx-AB8 : 64-pin plastic QFP (14 x 14 mm, 0.8-mm pitch)
μ
PD753108GC-xxx-AB8 : 64-pin plastic QFP (14 x 14 mm, 0.8-mm pitch)
Soldering
Method
Soldering Conditions
Symbol
Infrared reflow
Peak package’s surface temperature: 235 C, Reflow time: 30 seconds or less
(at 210 C or higher), Number of reflow processes: 3 max.
IR35-00-3
VPS
Peak package’s surface temperature: 215 C, Reflow time: 40 seconds or less
(at 200 C or higher), Number of reflow processes: 3 max.
VP15-00-3
Wave soldering
Solder temperature: 260 C or below, Flow time: 10 seconds or less, Number of
flow processes: 1, Preheating temperature: 120 C or below (package surface
temperature)
WS60-00-1
Partial heating
Pin temperature: 300 C or below, Time: 3 seconds or less (per device side)
—
Caution
Use of more than one soldering method should be avoided (except for partial heating).
(2)
μ
PD753104GK-xxx-8A8 : 64-pin plastic QFP (12 x 12 mm, 0.65-mm pitch)
μ
PD753106GK-xxx-8A8 : 64-pin plastic QFP (12 x 12 mm, 0.65-mm pitch)
μ
PD753108GK-xxx-8A8 : 64-pin plastic QFP (12 x 12 mm, 0.65-mm pitch)
Soldering
Method
Soldering Conditions
Symbol
Infrared reflow
Peak package’s surface temperature: 235 C, Reflow time: 30 seconds or less
(at 210 C or higher), Number of reflow processes: 2 max.
IR35-00-2
VPS
Peak package’s surface temperature: 215 C, Reflow time: 40 seconds or less
(at 200 C or higher), Number of reflow processes: 2 max.
VP15-00-2
Wave soldering
Solder temperature: 260 C or below, Flow time: 10 seconds or less, Number of
flow processes: 1, Preheating temperature: 120 C or below (package surface
temperature)
WS60-00-1
Partial heating
Pin temperature: 300 C or below, Time: 3 seconds or less (per device side)
—
Caution Use of more than one soldering method should be avoided (except for partial heating).
相關(guān)PDF資料
PDF描述
UPD753106GK 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER
UPD753108 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER
UPD753108GC 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER
UPD753108GK 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER
UPD75312B 4-BIT SINGLE-CHIP MICROCOMPUTER
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