參數(shù)資料
型號(hào)： UPD75316GF
廠商： NEC Corp.
英文描述： 4-BIT SINGLE-CHIP MICROCOMPUTER
中文描述： 4位單片機(jī)
文件頁(yè)數(shù)： 57/62頁(yè)
文件大?。?/td> 577K
代理商： UPD75316GF
μ
PD75312(A), 75316(A)
57
13. RECOMMENDED SOLDERING CONDITIONS
It is recommended that
μ
PD75316(A) be soldered under the following conditions.
For details on the recommended soldering conditions, refer to Information Document "Semiconductor
Devices Mounting Manual" (IEI-616).
The soldering methods and conditions are not listed here, consult NEC.
A model that can be soldered under the more stringent conditions (infrared reflow peak
temperature: 235
°
C, number of times: 2, and an extended number of days) is also available.
For details, consult NEC.
Notice
Table 13-1 Soldering Conditions
μ
PD75312GF(A) - xxx - 3B9: 80-pin plastic QFP (14
×
20 mm)
μ
PD75316GF(A) - xxx - 3B9: 80-pin plastic QFP (14
×
20 mm)
Soldering Method
Soldering Conditions
Symbol for Recommended
Condition
IR30-00-1
Infrared Reflow
Package peak temperature: 230
°
C,
time: 30 seconds max. (210
°
C min.),
number of times: 1
Package peak temperature: 215
°
C,
time: 40 seconds max. (200
°
C min.),
number of times: 1
Soldering bath temperature: 260
°
C max.,
time: 10 seconds max., number of times: 1,
pre-heating temperature: 120
°
C max. (package surface
temperature)
Pin temperature: 300
°
C max.,
time: 3 seconds max. (per side)
VPS
VP15-00-1
Wave Soldering
WS60-00-1
Pin Partial Heating
—
Caution: Do not use two or more soldering methods in combination (except the pin partial heating
method).
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