參數(shù)資料
型號: UPD754202A
廠商: NEC Corp.
英文描述: 4-BIT SINGLE-CHIP MICROCONTROLLERS
中文描述: 4位單晶片微控制器
文件頁數(shù): 57/66頁
文件大?。?/td> 302K
代理商: UPD754202A
57
μ
PD754202, 754202(A)
15. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD754202 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 15-1. Surface Mounting Type Soldering Conditions
μ
PD754202GS-
×××
-BA5
μ
PD754202GS-
×××
-GJG
μ
PD754202GS(A)-
×××
-BA5 : 20-pin plastic SOP (300 mil, 1.27-mm pitch)
μ
PD754202GS(A)-
×××
-GJG : 20-pin plastic shrink SOP (300 mil, 0.65-mm pitch)
: 20-pin plastic SOP (300 mil, 1.27-mm pitch)
: 20-pin plastic shrink SOP (300 mil, 0.65-mm pitch)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Reflow time: 30 seconds or below
(at 210
°
C or higher),
Number of reflow processes: Twice or less
IR35-00-2
VPS
Package peak temperature: 215
°
C, Reflow time: 40 seconds or below
(at 200
°
C or higher),
Number of reflow processes: Twice or less
VP15-00-2
Wave soldering
Solder temperature: 260
°
C or below, Flow time: 10 seconds or below,
Number of flow processes: 1
Preheating temperature: 120
°
C or below (package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C or below, Time: 3 seconds
or below
(per side of device)
Caution
Do not use different soldering methods together (except for partial heating).
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