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參數(shù)資料
| 型號： | UPD754244 |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCONTROLLERS |
| 中文描述： | 4位單晶片微控制器 |
| 文件頁數(shù)： | 78/88頁 |
| 文件大?。?/td> | 416K |
| 代理商： | UPD754244 |
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78
μ
PD754144, 754244
17. RECOMMENDED SOLDERING CONDITIONS
Solder the
μ
PD754244 under the following recommended conditions.
For the details on the recommended soldering conditions, refer to Information Document
“Semiconductor
Device Mounting Technology Manual (C10535E)”
.
For the soldering method and conditions other than those recommended, consult an NEC representative.
Table 17-1. Soldering Conditions of Surface Mount Type (1/2)
(1)
μ
PD754244GS-xxx-GJG: 20-pin plastic shrink SOP (300 mil, 0.65-mm pitch)
Soldering Method
Soldering Conditions
Symbol
Infrared ray reflow
Package peak temperature: 235
°
C, Reflow time: 30 seconds max. (210
°
C min.),
IR35-00-2
Number of reflow process: 2 max.
VPS
Package peak temperature: 215
°
C, Reflow time: 40 seconds max. (200
°
C min.),
VP15-00-2
Number of reflow process: 2 max.
Wave soldering
Solder bath temperature: 260
°
C max., Flow time: 10 seconds max.,
WS60-00-1
Number of flow process: 1
Preheating temperature: 120
°
C max. (package surface temperature)
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per side of device)
–
Caution
Do not use different soldering methods together (except for partial heating).
(2)
μ
PD754144GS-xxx-GJG: 20-pin plastic shrink SOP (300 mil, 0.65-mm pitch)
Soldering Method
Soldering Conditions
Symbol
Infrared ray reflow
Package peak temperature: 235
°
C, Reflow time: 30 seconds max. (210
°
C min.),
IR35-00-3
Number of reflow process: 3 max.
VPS
Package peak temperature: 215
°
C, Reflow time: 40 seconds max. (200
°
C min.),
VP15-00-3
Number of reflow process: 3 max.
Wave soldering
Solder bath temperature: 260
°
C max., Flow time: 10 seconds max.,
WS60-00-1
Number of flow process: 1
Preheating temperature: 120
°
C max. (package surface temperature)
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per side of device)
–
Caution
Do not use different soldering methods together (except for partial heating).
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD7554AG-597-E2 | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD7554AG-597-E2-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD7554AG-603-E2 | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD7554AG-603-E2-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD7554AG-611-E2 | 制造商:Renesas Electronics Corporation 功能描述: |
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